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Prof. Erping LI Appointed Vice President of Technology Innovation Strategic Alliance of Electromagnetic Environment Effect Industry in China

Editor: Date:2020-10-30 Hits:0

On October 27, 2020, the third session of the first Council of Technology Innovation Strategic Alliance of Electromagnetic Environment Effect Industry in China together with the special committee were held in Beijing. Over 60 representatives from 40 universities and enterprises, including Beijing University of Aeronautics and Astronautics, Zhejiang University, Peking University, Tsinghua University, Southeast University, Army Engineering University, Naval Engineering University attended the meeting. At the meeting, the list of new executive directors and directors of the alliance was announced, and the main work plan of the alliance in 2021 was discussed. LI Erping was appointed as the vice president and ZJU as the executive director unit.

From October 28 to 29, the 2020 China EMC and Technological Innovation Strategic Alliance of Electromagnetic Environmental Effect Industry was held in Beijing. The conference was hosted by the China Society of Optical Engineering, and invited academicians, authoritative experts from well-known research institutions, and senior representatives of enterprises at home and abroad to attend the meeting, conducting technical and industrial exchanges on chip devices, communication, automobile, national defense, aerospace and other fields. Prof.LI was invited as an academic expert and gave a keynote report entitled Electromagnetic Compatibility of Micro Nano Size and Smart Chip.

Starting from the development of electronic industry and the key problems of EMC, Prof.LI Erping deeply expounded the research on electromagnetic radiation of chip level packaging, modeling and testing methods of 3D IC interconnection structure, as well as the  research on signal integrity of high-frequency chips. Facing the fourth industrial revolution based on artificial intelligence, big data platform and cloud system, he pointed out that artificial intelligence was already at the core frontier of scientific and technological revolution and industrial transformation, and the core foundation of physical layer for further development of artificial intelligence was artificial intelligence chip. He stressed that the development of AI chips in the future would face many EMC reliability challenges. We need to study the electromagnetic integrity, signal and power integrity of AI chips, so as to meet the growing demand for chip performance and play a fundamental role in boosting China's future international competitiveness in AI chips.


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